Compact Manual Prober HMP-400(4-inch)/HMP-600(6 inch)
This probe system corresponds from on-chip measurement to measuring small diameter wafers up to4 inches or 6 inches. This manual prober is suitable for R&D.
- I-V/C-V measurement in fAfemtoampere) level and fF(femtofarad) level.
- Selectable tri-axial structured chuck enables ultra low current back gate measurement in fA level.
- It can equip high temperature chuck ranging from RT to +300℃.
- Repeatability of contact separation movement is within 2 μm
- Planarity of chuck surface is 10 μm or less
NOTE: Currently we do not sell to the following countries. U.S.A, Canada, Australia
Mechanism
Platen Z Axis Guide
It equips ultra precision post bush, which enables steady probe contact with precise and smooth operation.
Microscope Mount
The microscope position can be moved with 3 joint horizontal swing arm.
Mechanism of Stage Movement
Two linear motion guides in the X axis and Y axis direction enables stable linier motion in the horizontal and vertical directions along the guide, which makes it possible to probe to regular patterns arranged on the wafer.
NOTE: Currently we do not sell to the following countries. U.S.A, Canada, Australia
Available Option
Dedicated cables is standard attached and you can select the terminating connector according to the measuring instrument.
NOTE: Currently we do not sell to the following countries. U.S.A, Canada, Australia
Ultra Low Current Measurement Ability
The following plot is a result of measuring the current value while impressing the sweep voltage from -200 to +200V to the probe and the chuck that are in open state. The result shows the noise and leak current of less than +/-10fA in all the ranges between -200V to 200V. It means that our probe system corresponds to ultra low signal measurement application that requires measurement precision of 100fA or less.
Model A74CJ
1tip-Kelvin Coaxial Probe
Model HCP40 Coaxial Probe
Model HTC40 Tri-axial Chuck
(Room Temperature)
Typical Specification
Item | HMP-400 | HMP-600 |
---|---|---|
Wafer size | Up to φ100mm | Up to φ150mm |
X-Y coarse travel | X: 105mm, Y:150mm | X: 155mm, Y: 200mm |
X-Y fine travel | XY: 13mm / Micro meter head | |
θ travel | coarse±30°,fine ±2.5° | |
Platen Z axis action | 0 – 20mm free | |
Platen Z axis adjustment | 0 – 15mm | |
Unit dimension | 350x390x450mm | 390x450x450mm |
Weight | 28kg | 36kg |
NOTE: Currently we do not sell to the following countries. U.S.A, Canada, Australia